ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,450,506, issued on Oct. 21, was assigned to Voicemonk. Inc. (Sunnyvale, Calif.). "System and method for recommending actions on a device" was i... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,446,658, issued on Oct. 21, was assigned to NIKE Inc. (Beaverton, Ore.). "Sole structure for article of footwear" was invented by Fidencio Camp... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,155, issued on Oct. 21. "System for the management of loading and unloading operations of UAV" was invented by Francesco Ricci (Santarcange... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,036, issued on Oct. 21, was assigned to BHS-Sonthofen GmbH (Sonthofen, Germany). "Device for tensioning a stuffing box packing" was invente... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,255, issued on Oct. 21, was assigned to Waymark Inc. (San Francisco). "Operationalizing predicted changes in risk based on interventions" w... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,450,737, issued on Oct. 21, was assigned to FUJIFILM Corp. (Tokyo., Japan). "Learning device, image generation device, learning method, image g... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,451,368, issued on Oct. 21, was assigned to MILAEBO Co. LTD. (Pyeongtaek-si, South Korea). "Process stop loss reduction system through rapid re... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,449,918, issued on Oct. 21, was assigned to Beijing Zitiao Network Technology Co. Ltd. (Beijing). "Panel interaction method, apparatus, device ... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,448,160, issued on Oct. 21, was assigned to Hoffman-La Roche Inc. (Little Falls, N.J.). "Method of filling degassed drug product into container... Read More
ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,453,158, issued on Oct. 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei, China). "Semiconductor structure and manufacturing method... Read More